Thermal interface material is used to fill the gaps between thermal transfer surfaces, such as between microprocessors and heat sinks, in order to increase thermal transfer efficiency. These gaps are normally filled with air which is a very poor conductor. The material is easy to handle and is not messy. It is available in solid and liquid form and in various thicknesses.
Thermal conductivity
The thermal conductivity of the interface material has a significant impact on its thermal performance. The high thermal conductivity guarantees sufficient heat transfer, resulting in a better cooling solution and the desired heat dissipation.
Properties
Good insulation properties
Heat-conducting
Good compressibility
Flexible
Environmentally friendly
Benefits
Smooth surface
Very good thermal transfer properties even at very low contact pressure
Low hardness
High self-adhesion
UL listed
Thickness 0.01 to 8 mm
This film is especially suitable for high-power applications. It has excellent thermal and electrical properties. Thanks to its good performance, the material can be used reliably in densely packed electronic applications.
Standard part numbers
Part number
Thermal conductivity
Thermal resistance
Hardness
Characteristics
W/mK
K/W
Shore 00
1150-600
6.0
0.20
60-70
Highest thermal conductivity
1150-500
5.0
0.25
75
High thermal conductivity
1150-300
3.0
0.41
65
Flexible, high thermal conductivity
1150-320
2.5
0.50
30-35
very soft, good dielectric properties
1150-255
2.0
0.85
30
Soft, high thermal conductivity
1150-202b
1.4
0.90
25
Good price-performance-ratio
1150-105
1.3
0.95
60
Low bleeding behaviour
1150-200
1.0
1.5
10
Soft, highly compressible
1150-210lb
1.0
1.5
15
Low bleeding behaviour
Example
If you would like to order 500 pieces of Tim-500 in 1 mm thickness, 50 x 50 mm the partnumber should look like:
Part number
Thickness (mm)
Width (mm)
Length (mm)
1150-500
1
50
50
Specify the thickness in mm
Specify the width in mm
Specify the length in mm
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